SILICONEVALLEY CO., LTD
Thermally Conductive Encapsulant
Product Properties
| Uncured Properties | Unit | SV-PTG100 | SV-PTG250 | ||
|---|---|---|---|---|---|
| A | B | A | B | ||
| Base Material | - | Silicone Free | Silicone Free | ||
| Appearance | - | White | Dark gray | White | Dark gray |
| Viscosity (at 23℃) | cps | 50,000 | 300,000 | 70,000 | 450,000 |
| Mix ratio by weight | - | 1 : 1 | 1 : 1 | ||
| Pot Life ( at 25℃ ) | minutes | < 30 | < 30 | ||
| Cure Time ( at 25℃ ) | Hour | 48 | 48 | ||
| Shelf Life ( at 25℃ ) | months | 6 | 6 | 6 | 6 |
| Cured Properties | Unit | SV-PTG100 | SV-PTG200 | ||
| Appearance (Mixed) | - | Gray | Gray | ||
| Hardness | Shore 00 | 80±10 | 80±10 | ||
| Specific Gravity | - | 2.2 | 2.7 | ||
| Dielectric strength | KV/mm | 10 | 10 | ||
| Volume Resistivity | Ω·㎝ | 10¹² | 10¹² | ||
| Continuous Use Temp. | ℃ | -40~80 | -40~80 | ||
| Thermal Conductivity | W/mk | 1.0 | 2.5 | ||
Applications
- Telecommunications
- Automotive electronics
- Computer and peripherals
- Power conversion
- Between heat-generating semiconductors and a heat sink
- Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Thermally Conductive RTV Encapsulant
Product Properties
| Properties | Unit | Value | Remark |
|---|---|---|---|
| Base Material | - | Silicone | |
| Appearance( 2-Parts ) | A Part | White | Base |
| B Part | Transparent | Catalyst | |
| Specific gravity | - | 1.40 ± 0.05 | ASTM D792 |
| Hardness | Shore A | 22 ± 5 | - |
| Viscosity | cP | 9,000 ± 2,700 | Part A (Base) |
| 70 ± 20 | Part B (Catalyst) | ||
| Dielectric strength | kV/mm | 26 | ASTM D149 |
| Volume resistance | Ohm.cm | 1 x 1015 | ASTM D257 |
| Tack free time | min | < 15 | - |
| Snap time | min | 10~15 | - |
| Curing Time at RT | Hr | 72 | - |
| Thermal Conductivity | W/mK | 0.4 < | ASTM D5470 |
| Flame resistance | - | UL94-V0 Level ( Self Test ) | |
Features
- Flowable / Non-corrosive
- Room temperature curing (Alkoxy Cure) / Good dielectric strength
- Thermal stability (-55 ~ 200℃) / Excellent adhesion (Metals and Plastics)
- Solvent free / Low shrinkage
How to use
Mixing
1) RTP-1422 is supplied in two parts, 6:1 mix ratio (Part A and Part B) by weight.
2) When fully blended, the Part A and Part B liquid mixture should have a uniform appearance.
3) The Presence of bright-colored stripes or marbling indicates that mixing is insufficient and curing will be incomplete.
Processing and Curing
1) A fully mixed RTP-1422 can be injected/dispensed directly into the junction box or module container.
2) Care must be taken to minimize air trapped.
3) Where possible, injection/dispensing should be carried out in a vacuum.