Thermally Conductive Encapsulant
Product Properties
| Uncured |
Unit |
STG-M608 |
STG-M250 |
STG-M300 |
| A |
B |
A |
B |
A |
B |
| color |
Visual |
White |
Darkgray |
White |
Darkgray |
White |
Darkgray |
| Viscosity(At 25℃) |
Cps |
3,200 |
3,200 |
10,000 |
10,000 |
80,000 |
80,000 |
| Mixed ratio |
wt% |
1 : 1 |
1 : 1 |
1 : 1 |
| Pot Life(at 25℃) |
Min. |
100 |
60 |
60 |
| Curing time(at 60℃) |
Min. |
60 |
30 |
30 |
| Cured |
Unit |
STG-M608 |
STG-M250 |
STG-M300 |
| Thermal conductivity |
W/mk |
0.7 |
2.5 |
3.0 |
| Appearance |
- |
Potting Gel |
| Hardness( Shore ) |
00 |
70±10 |
80±10 |
80±10 |
| Specific gravity |
g/㎤ |
1.7 |
3.0 |
3.0 |
| Volume resistivity |
Ω-㎝ |
1.0E+13 |
1.0E+12 |
1.0E+12 |
| Breakdown voltage |
KV/mm |
10 |
10 |
10 |
| Use Temperature |
℃ |
-50~200 |
| Flame rating |
UL94 |
V-0 |
Features( STG-M608 )
- Flame Resisting : UL94 V-0 recognized ( File No. : E306107 ) / UL746A ( HWI : 0 / HAI : 0 / CTI : 0 )
- Easy 1 : 1 mix ratio by weight.
- Excellent thermal conductivity.
- Potting of electronics parts requiring flammability and use under high Temperature
- Potting Gel for high voltage parts.
- To protect curing faulty, Do not contact phosphorus, sulfur, paraffin element, compound and BHT(Butylated Hydroxy Toluene) when curing silicone.
Packing Specification
Applications
siliconevalley@siliconevalley.co.kr
